Thermal Interface Materials

TIM 1 – Thermal Gel

Shrinking die and increasing power demands continue to make thermal conductive compounds a critical part of IC package design. The use of silicone gel is necessary for proper heat dissipation, to improve performance and reliability of devices by enabling packages to run cooler.

Shin-Etsu’s thermal gel enables users to reduce the overall cost of their thermal solution.

TIM 2 – Thermal Grease

Thermal grease is a thermally conductive silicone paste acting as a medium between heat sinks and microprocessors. With its high thermal conductivity values, thermal grease is ideal for use as the primary thermal interface material (TIM 1 and TIM 2) for CPUs, MPUs and GPUs. G765 has a high insulation thermal resistance, while the other compounds were formulated to emphasize thermal conductivity X23-7762 and X23-7783D product offerings were formulated emphasize high bulk thermal conductivity values and ease of workability.

TIM 1.5 – Two Part Curable Gap Fillers

Shin-Etsu’s two-part Gap Fillers are silicone materials with fillers that provide high thermal conductivity while maintaining electrical isolation. The main application for these Thermal Interface Materials is to fill gaps between components and heat sinks. Applied in liquid form, they produce less stress on components during assembly. The material cures in place and remains a soft elastomer.  Shin-Etsu’s two-part Gap Fillers can be used on a larger range of gap thicknesses.  The liquid material can be applied in different thicknesses in adjacent areas to account for varied interface topography.  They provide a natural tack between mating surfaces but do not create a structurally adhesive connection.

High Hardness Thermal Interface Silicone Rubber Pad Materials

Shin-Etsu Chemical’s High Hardness TC pad series offers a high thermal conductivity and a low thermal resistance solution that outperforms common organic rubbers and plastics.

As demands for faster electronic devices increase, typically so does the amount of heat generated, requiring the need for higher degree of silicone hardness. If heat cannot escape efficiently, the performance of the device tends to degrade. That is why Shin-Etsu Chemical’s thermal interface, high hardness materials are consistently utilized in the electronics industry and are considered an important tool in meeting higher performance targets for next generation devices.

Phase Change Material (PCM)

Shin-Etsu Chemical’s thermally conductive phase change thermal pad utilizes phase change material that offers superior cooling solutions for increased thermal management. The PCS series phase change thermal pad is designed to achieve low contact resistance with a thin bond line thickness. Shin-Etsu Chemical’s phase change material is consistently utilized in the electronics industry and is considered an important tool in meeting higher performance thermal targets for next generation devices.

This phase change thermal pad, made up of silicone rubber thermal interface materials, contains a high percentage of thermally conductive fillers to dissipate heat, while utilizing an optimal softening temperature. Shin-Etsu Chemical’s phase change material exhibits outstanding thermal performance and stability when filling the gap between the heat-generating device and its corresponding heat sink.

Pads & Phase Change Material (PCM)

Silicone-based Matrix with High Thermally-Conductive Filler

Shin-Etsu MicroSi Pad Cooling Solutions:

  • High Hardness Thermal Interface Silicone Rubber Pad Materials
  • Low Hardness Thermal Interface Silicone Rubber Pad Materials
  • Phase Change Material (PCM)
  • Double-sided tape
  • Electrically Conductive

 

Low Hardness Thermal Interface Silicone Rubber Pad Materials

Shin-Etsu Chemical’s Low Hardness TC pad series offers a high thermal conductivity and a low thermal resistance solution that outperforms common organic rubbers and plastics.

As demands for faster electronic devices increase, typically so does the amount of heat generated. If heat can not escape efficiently, the performance of the device tends to suffer. That is why Shin-Etsu Chemical’s thermal interface materials are consistently utilized in the electronics industry and are considered an important tool in meeting higher performance targets for next generation devices.

Double-Sided Tape

Shin-Etsu Chemical’s TC-SAS thermal conductive tape is a non-acryl based, adhesive, double sided thermal tape that offers superior thermal conductivity, peeling and high adhesion strength properties.

Additional advantages of the TC-SAS thermal conductive tape is the excellent electrical isolation features and easy to apply and remove for rework.

Electrically Conductive

The products in our electrically conductive materials series have the superior qualities of silicone rubber, plus electrical conductivity thanks to the addition of carbon and other conductive materials. They are available in many forms, including sheets, tapes, O-rings and other desired shapes; and are ideal for electromagnetic shielding for office equipment and medical equipment, and as antistatic rubber for electric and electronic equipment.

Free Samples

 

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