Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s X-23- 7772-4 thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of X-23- 7772-4 to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s X-23-7772-4 is designed to meet current and future thermal management requirements, thus providing dropin solutions for new IC packages, without the expense of qualifications. This highly thermal conductive gel has been successfully used throughout the semiconductor industry on temperature sensitive components.
Shin-Etsu MicroSi can provide X-23-7772-4 in 60gm cartridges. The cartridge delivery system can be utilized with automated equipment to minimize waste and provide an accurate dispense
weight. The cartridge delivery system allows dispensing of the material, while protecting the integrity and exposure level of the unused portion.
This curing silicone gel is homogenous with unique fillers that enhance thermal conductivity. X-23-7772-4 is supplied in grease form. When exposed to ambient temperatures the material starts to cure, forming an excellent interface between substrates providing excellent thermal conductivity.
|Viscosity @ 25°C (Pascal Second)||176|
|Bleed (425 °K/24 hr)||0|
|Volatile Content after 24hrs. at 150°C (%)||<0.39%|
|Thermal Conductivity (W/m °K)||3.5|
|Cure Conditions||125°C / 90 min|
|Storage Conditions||60°F to 85°F|
|Custom Sizes Available||Contact Us|