Thermal Grease X23-7868-2D

Package temperature constraints can severely limit a power device’s performance. Both the performance reliability and life expectancy are inversely related to the device temperature. Shin-Etsu MicroSi’s X23- 7868-2D is an ideal thermal interface material for high performance based platforms.

Description

  • Excellent thermal resistance (TR) and thermal conductivity (TC)
  • Low viscosity at the time of application, easily applied via dispensing, stencil printing, or screen printing methods
  • Stable homogeneous mixture for consistent thermal performance
    RoHS and REACH Compliant
  • High volume production product from a proven industry leader Available worldwide through established supply chain networks

Material Properties

PropertyValue
Viscosity @ 25°C (Pascal Second)100/680
AppearanceGray
Volatile Content after 24 hrs. at 150°C (%)2.8
Specific Gravity2,6

Sizes Available

ContainerWeight
Syringes:0.5 gm, 1.0 gm, 1.5 gm
Cartridges:55 gm, 150 gm, 400 gm
Bulk:1.0 Kg
Storage Conditions60°F to 85°F
Custom Sizes AvailableContact Us

Product Application

Evaluation: Uniform Thickness Approach:

  1. Review the provided MSDS.
  2. Remove any existing thermal interface material from the test fixture, if present.
  3. Using an adhesive tape, box out a square section on the heatsink that is equal to, if not slightly larger than the processor.
  4. In a well ventilated environment place the contents of the sample syringe in a dollop form, at the center of the heatsink.
  5. Using a flat, straight edge, spread the material in such a manner that the material is equally spread out over the exposed surface of the heatsink. The thinner the material the better.
  6. Once a uniform thickness is achieved, remove the adhesive tape, in such a manner that the thermal interface material remains on the heatsink.
  7. Please note that these materials contain an application chemical that needs to be removed for optimal performance. If possible, allow the heatsink to sit exposed overnight, to allow the application chemical to evaporate.
  8. Evaluate the material in the assembly, until the thermal resistance value has stabilized.

Dollop Pattern Approach:

  1. Review the provided MSDS.
  2. Remove any existing thermal interface material from the test fixture, if present.
  3. In a well ventilated environment place approximately half of the contents of the sample syringe in a dollop form, at the center of the heatsink.
  4. Reassemble the test fixture in such a manner that the thermal interface material is distributed across the chip surface and heatsink.
  5. Please note that these materials contain an application chemical that needs to be removed for optimal performance. This can be accomplished by operating the assembly in an open environment.
  6. Evaluate the material in the assembly, until the thermal resistance value has stabilized.

For medium to large production applications, Shin-Etsu MicroSi can provide X-23-7868- 2D in cartridges. The cartridge delivery system can be utilized with either manual, automated or silk-screening equipment. The cartridge delivery system allows dispensing of the material, while protecting the integrity and exposure level of the unused portion.

Bulk delivery provides the lowest possible unit cost. Bulk purchases are available for large scale production facilities where material is consumed at a rapid rate.