SIPR-9740

Shin-Etsu MicroSi’s SIPR 9740 I-line/G-line photoresist has a printing capability of less than 300nm isolated line and semi-dense lines in 1-15 um thick photoresist. This DNQ photoresist is widely utilized in Semiconductor, MEMS, thin film head and microelectronics applications that require superior process latitude for lift-off, plating, wet etching, and RIE. Though TMAH developer is preferred, KOH is also acceptable.