Thermal Grease X23-8117
Shin-Etsu’s X-23-8117 product offering is a thermal interface material developed and manufactured with ease of application in mind. Specifically formulated to include an application chemical optimized for screen printing and other application techniques, X-23-8117 outperforms in high volume manufacturing environments. With high Thermal Conductivity coupled with low Thermal Resistance, this product often exceeds thermal management requirements of high-performance semiconductor devices. Through superior heat dissipation, X-23-8117 allows electronic devices to remain cooler and increases long-term reliability.
Links to Technical Data Sheets
X23-8117 (189.82kB) ![]()
Product Description
- Excellent thermal resistance (TR) and thermal conductivity (TC)
- Low viscosity at the time of application, easily applied via dispensing, stencil printing, or screen printing methods
- Stable homogeneous mixture for consistent thermal performance RoHS and REACH Compliant
- High volume production product from a proven industry leader Available worldwide through established supply chain networks
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| Property | Value | |
| Viscosity (pre-flash) | 80 | |
| Viscosity (post-flash) | 700 | |
| Appearance | “Gray” | |
| Specific Gravity | 2.8 | |
| Thermal Conductivity * (W/m °K) | 6.2 | |
| Thermal Resistance ** mm2•K/W | 6.1 | |
| Bond Line Thickness (um) @20psi | 26 | |
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| Container | Weight | |
| Syringes: | “0.5, 1, 1.5, 3” | |
| Cartridges: | “55 gm” | |
| Bulk: | “1.0 Kg” | |
| Storage Conditions | “32°F to 85°F” | |
| Custom Sizes Available | Contact Us | |