Adhesion Promoters
Our HMDS and HMDS with DEATS adhesion promoters are used to enhance the bonding of photoresist to a wafer substrate surface. Shin-Etsu MicroSi’s MicroPrime™ adhesion promoter line readily reacts with the substrate material removing adsorbed water and reducing surface energy.
The water repellent hydrophobic interface resulting from the adhesion promoter prevents etchants from undercutting the photoresist.
- 100% (HMDS)
Highly purified grade of hexamethyldisilazane (HMDS) manufactured specifically for semiconductor applications
- 99.5% HMDS, <0.5% DEATS
- 99.0% HMDS, <1.0% DEATS
HMDS modified with DEATS provides an increased contact angle that can improve adhesion characteristics on difficult substrates. An increase in the reaction mechanism provides an improved throughput.