Description
Silicone Die Attach Materials
- Low internal stress
- High adhesive strength
- Less contamination
KJR-9602-5
Shin-Etsu is a leader in developing advanced, semiconductor packaging materials for encapsulating all types of semiconductor devices. This broad line of products is made of silicone molding compounds and epoxy molding compounds that offer low stress, very low warpage, and high thermal conductivity.
Additional information
| Color | Black |
|---|---|
| Viscosity (Pa*s) | 1,700 |
| Hardness | A 35 |
| Elongation (%) | 300 |