KMC-8000X

Shin-Etsu is a leader in developing advanced, semiconductor packaging materials for encapsulating all types of semiconductor devices. This broad line of products is made of silicone molding compounds and epoxy molding compounds that offer low stress, very low warpage, and high thermal conductivity.

Description

Molding Compounds

  • Low Internal Stress
  • Stable at High Heat & Voltage
  • High Thermally Conductive Formulations

Additional information

Flame Retardant

Green

Flexural Strength (N/mm2)

120

Flexural Modulus (N/mm2)

12,000

Tg (°C)

225

CTE 1 (ppm/°C)

16

CTE 2 (ppm/°C)

38

Product Documents

Shin-Etsu Packaging Materials OEM Line Card

X

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