Description
Thermally Conductive Silicone Adhesives
- Thermoset Adhesive
- High Adhesive Strength
- Low Temperature Cure Adhesive
- No Induced Stress by Heating
- Conformal Film Adhesive
LPS-AF500EC
Shin-Etsu is a leader in developing advanced, semiconductor packaging materials for encapsulating all types of semiconductor devices. This broad line of products is made of silicone molding compounds and epoxy molding compounds that offer low stress, very low warpage, and high thermal conductivity.
Additional information
| Thermal Conductivity (W/mk) | 13.7 |
|---|---|
| Application | Film |
| Cure Temperature (°C) | 150 |
| Hardness | – |
| BLT (µm) | 50 |