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MicroPrime MP90

MicroPrime MP-90 Adhesion Promoter is a blend of hexamethyldisilazane and N,N-diethylaminotrimethylsilane (HMDS (99.0%) and DEATS(0.1%) (CH3)3SiNHSi(CH3)3/(CH3)3SiN(C2H5)2. Shin-Etsu’s adhesion promoters are used to enhance the bonding of photoresist to a silicon dioxide surface. Shin-Etsu MicroSi’s MicroPrime™ line of adhesion promoters readily react with the substrate material removing water and reducing surface energy. The resulting water repellent hydrophobic interface prevents etchants from undercutting the photoresist.

Description

Product characteristics

  • MP-90 is optimized for efficient, high H2O contact angle, vapor priming on semiconductor in-line track coating equipment.
  • The combination of DEATS, an aminofunctional silane, with HMDS provides a more highly reactive surface treatment to reduce photoresist lifting on common semiconductor surfaces including silicon, poly, oxide nitride, Silicides and BPSG.
  • MicroPrime MP-90 Adhesion Promoter is completely compatible with components with which HMDS is compatible

Reaction Mechanism

  • MP-90 reacts readily with silicon oxide surfaces (metal oxides, silicon dioxide, etc.) removing adsorbed water and reducing substrate surface energy.
  • Further reaction then occurs between MP-90 and surface hydroxyls (silanols, metalhydroxides) resulting in a trimethylsiloxylated surface and prevention of future adsorption of water and other polar materials. During this process small amounts of diethylamine and ammonia are produced.
  • MP-90 functions as a surface modifying agent. Photoresist will then coat these surfaces more uniformly; problems of photoresist lifting and subsequent undercutting are reduced.
  • MicroPrime MP-90 Adhesion Promoter is designed and recommended for track vapor priming in semiconductor lithography processes

Application

MP-90 can be applied to oxide substrates by several techniques, including vapor prime, spinning and spraying. Environmentally stable primed substrates with uniform coverage are obtained by treatment in vapor deposition tracks and ovens. This efficient method of application offers rapid and uniform reproducible priming of substrates with a minimum quantity of MP-90. Apply a small amount of MP-90 neat to a wafer spun at 3000-5000 rpm at ambient temperature. Pre-bake at 70-150°C. Post-exposure bake at 70-150°C. This aminofunctional, low viscosity organosilane is more reactive with the hydroxyl radicals on silicon dioxide than hexamethyldisilazane (HMDS). Therefore, use of MP-90 results in greater coverage and more efficient surface treatment in a shorter time

Product Documents

Technical Data Sheet

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