SFX-5603-7AQ

Shin-Etsu is a leader in developing advanced, semiconductor packaging materials for encapsulating all types of semiconductor devices. This broad line of products is made of silicone molding compounds and epoxy molding compounds that offer low stress, very low warpage, and high thermal conductivity.

Description

Liquid Epoxy Encapsulants

  • Low Internal Stress
  • Stable in Harsh Environments
  • Oil, Chemical & Thermal Shock Resistance

Additional information

Viscosity (Pa*s)

80

Tg (°C)

150

CTE (ppm/°C)

35

Flexural Modulus (N/mm2)

8

Product Documents

Shin-Etsu Packaging Materials OEM Line Card

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