Description
Wafer Backside Coating Materials
- Smooth surface after printing
- Good dicing performance
- No die motion during wire bonding
SFX524G2C
Shin-Etsu is a leader in developing advanced, semiconductor packaging materials for encapsulating all types of semiconductor devices. This broad line of products is made of silicone molding compounds and epoxy molding compounds that offer low stress, very low warpage, and high thermal conductivity.
Additional information
| Color | Black |
|---|---|
| Viscosity (Pa*s) | 17 |
| Hardness MPa (Flexural Modulus) | 1,600 |