Description
This product has low dielectric characteristics close to those of fluorocarbon resins as well as high strength and high elasticity. The lowest level dielectric properties with a dielectric constant of less than 2.5 in the high-frequency band (10~80GHz) and a dielectric dissipation factor of less than 0.0025 are achieved by this thermoset resin.
Because it has the properties of low moisture uptake and high adhesive strength to low profile copper (low roughness copper foils) as well, it is suitable for usage in such areas as FCCL (flexible copper clad laminates) and as an adhesive agent.
We are also planning to develop low dielectric encapsulant materials and low dielectric high-thermal conductivity adhesives.
Shin-Etsu has reached a license agreement with Novoset, LLC regarding ultra low-loss dielectric resin with high-temperature resistance and very low moisture absorbency. Adding these products to our product line-up will strengthen our market position in CCL (copper-clad laminates), rigid laminated circuit boards (multilayer IC substrates), antennas and radar domes for communication base stations that require high heat resistance and reliability.