Description
Liquid Epoxy Encapsulants
- Low Internal Stress
- Stable in Harsh Environments
- Oil, Chemical & Thermal Shock Resistance
SMC-762NN
Shin-Etsu is a leader in developing advanced, semiconductor packaging materials for encapsulating all types of semiconductor devices. This broad line of products is made of silicone molding compounds and epoxy molding compounds that offer low stress, very low warpage, and high thermal conductivity.
Additional information
| Viscosity (Pa*s) | 30 |
|---|---|
| Tg (°C) | 145 |
| CTE (ppm/°C) | 14 |
| Flexural Modulus (N/mm2) | 15 |