Description
Package temperature constraints can severely limit a power device’s performance. Both the performance reliability and life expectancy are inversely related to the device temperature. Shin-Etsu MicroSi’s X23- 7868-2D is an ideal thermal interface material for high performance based platforms.
Product Description
- Excellent thermal resistance (TR) and thermal conductivity (TC)
- Low viscosity at the time of application, easily applied via dispensing, stencil printing, or screen printing methods
- Stable homogeneous mixture for consistent thermal performance RoHS and REACH Compliant
- High volume production product from a proven industry leader Available worldwide through established supply chain networks
Sizes Available
| Container | Weight |
|---|---|
| Syringes: | 0.5 gm, 1.0 gm, 1.5 gm |
| Cartridges: | 55 gm, 150 gm, 400 gm |
| Bulk: | 1.0 Kg |
| Storage Conditions: | 60°F to 85°F |
| Custom Sizes Available | Contact Us |