Description
Thermal grease, X23-7911, is a Non-Solvent thermal interface material developed and manufactured by Shin-Etsu Chemical Co., Ltd. Shin-Etsu MicroSi’s X23-7911 exceeds thermal management requirements of high-performance semiconductor devices. Through superior heat dissipation, the X23-7911 allows electronic devices to remain cooler and increases their long term reliability. Typical applications include semiconductor devices: power transistors, ICs, CPUs, stacked memory modules or any application that requires a thermal solution.
Product Description
- Excellent thermal resistance (TR) and thermal conductivity (TC)
- Easily applied via dispensing, stencil printing, or screen printing methods
- Stable homogeneous mixture for consistent thermal performance
- RoHS and REACH Compliant
- High volume production product from a proven industry leader
- Available worldwide through established supply chain networks