Thermal Grease X-23-7943

Thermal grease, X23-7943, is a Non-Solvent thermal interface material developed and manufactured by Shin-Etsu Chemical Co., Ltd. Shin-Etsu MicroSi’s X23-7943 exceeds thermal management requirements of high-performance semiconductor devices. Through superior heat dissipation, the X23-7943 allows electronic devices to remain cooler and increases their long term reliability. Typical applications include semiconductor devices: power transistors, ICs, CPUs, stacked memory modules or any application that requires a thermal solution.

Description

Thermal grease, X23-7943, is a Non-Solvent thermal interface material developed and manufactured by Shin-Etsu Chemical Co., Ltd. Shin-Etsu MicroSi’s X23-7943 exceeds thermal management requirements of high-performance semiconductor devices. Through superior heat dissipation, the X23-7943 allows electronic devices to remain cooler and increases their long term reliability. Typical applications include semiconductor devices: power transistors, ICs, CPUs, stacked memory modules or any application that requires a thermal solution.

 

Product Description

 

Packaging Description X23-7943
Syringes 0.5 gm, 1.0 gm
Cartridges 55 gm
Bulk 1 kg can
Custom Sizes Available
Storage Conditions 32 °F to 85 °F

Additional information

Appearance

Gray

Viscosity (PA*S)

130

Specific Gravity

2.6

Thermal Conductivity (W/M * °K)

5.4

Thermal Resistance (mm2-K/W)

5.8

Bond Line Thickness (MM)

25

Product Documents

X23-7943 TDS (439.83kB)

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