Thermal Grease X-23-8117

Shin-Etsu’s X-23-8117 product offering is a thermal interface material developed and manufactured with ease of application in mind. Specifically formulated to include an application chemical optimized for screen printing and other application techniques, X-23-8117 outperforms in high volume manufacturing environments. With high Thermal Conductivity coupled with low Thermal Resistance, this product often exceeds thermal management requirements of high-performance semiconductor devices. Through superior heat dissipation, X-23-8117 allows electronic devices to remain cooler and increases long-term reliability.

Description

Shin-Etsu’s X-23-8117 product offering is a thermal interface material developed and manufactured with ease of application in mind. Specifically formulated to include an application chemical optimized for screen printing and other application techniques, X-23-8117 outperforms in high volume manufacturing environments. With high Thermal Conductivity coupled with low Thermal Resistance, this product often exceeds thermal management requirements of high-performance semiconductor devices. Through superior heat dissipation, X-23-8117 allows electronic devices to remain cooler and increases long-term reliability.

 

Product Description

 

Sizes Available

Container Weight
Syringes: “0.5, 1, 1.5, 3”
Cartridges: “55 gm”
Bulk: “1.0 Kg”
Storage Conditions “32°F to 85°F”
Custom Sizes Available Contact Us

Additional information

Viscosity (Pre-flash)

80

Viscosity (Post-flash)

700

Appearance

Gray

Specific Gravity

2.8

Thermal Conductivity (W/M * °K)

6.2

Thermal Resistance (mm2-K/W)

6.1

Bond Line Thickness (um) @20psi

26

Product Documents

X23-8117 (189.82kB)

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