Description
Shrinking die and increasing power demands continue to make thermal conductive compounds a critical part of IC package design. The use of silicone gel is necessary for proper heat dissipation, to improve performance and reliability of devices by enabling packages to run cooler. Shin-Etsu’s thermal gel enables users to reduce the overall cost of their thermal solution.
Shin-Etsu MicroSi’s thermal gel X23-7772-4 has been the industry choice of materials to meet current and future thermal management requirements, thus providing drop-in solutions for new IC packages, without the expense of qualifications. This highly thermal conductive compound is successfully used throughout the semiconductor industry on temperature sensitive components.
Building on the success and experience gained from X23-7772-4, Shin-Etsu continues to develop a number of TIM1 materials, which are as unique as the technical challenges end users face daily.
Due to the size and power of some of the latest packages, delamination due to warpage can be a critical factor.
To solve these issues Shin-Etsu concentrated on developing products with:
- Good Adhesive strength
- Good Elongation
Our TIM1 R&D team has developed a number of products with different mechanical properties to address warpage, higher thermal conductivity and lower thermal resistance.
The products are grouped into three categories:
- Gel Materials with high elongation (X23-7772-4 is one of the products in this group)
- Hard Adhesive type TIM, products in HVM
- Soft Adhesive type TIM, product sin HVM
We are constantly upgrading our product portfolio, for this reason X23-7772-4 properties are published in this page as a sample. Our team is eager to work with you to qualify materials that will best fit your requirements.
Please feel free to contact us for further details on any of the product types mentioned above. If your requirement does not fit into one of the groups we highlighted we can work with you to develop a thermal solution that’s just right for your specific needs.