X-23-8068-A/B

X23-8068 A/B is a two part gap filler. It can be cured with either heat or at room temperature. X23-8068 A/B is a thermal interface gap filler and provides excellent thermal conductivity, electrical insulation, and low thermal resistance. Doe to it’s natural high natural tackiness it is able to anchor to necessary substrates, but develops no chemical adhesion that allows superior re-workability.

Description

X23-8068 A/B is a two part gap filler. It can be cured with either heat or at room temperature. X23-8068 A/B is a thermal interface gap filler and provides excellent thermal conductivity, electrical insulation, and low thermal resistance. Doe to it’s natural high natural tackiness it is able to anchor to necessary substrates, but develops no chemical adhesion that allows superior re-workability.

Product Characteristics:

Instructions for Use:

Each product comes as separate A and B components that must be mixed together in 1:1 ratio to initiate the curing reaction. The curing reaction proceeds at room temperature, so the work should be done as quickly as possible. Be sure to use a specialized dispenser. Before work begins, clean all containers and tools to be used so they are free of dirt, water, oil, etc.

Packages:

Additional information

Main Filler

Al2O3 Insulation

Appearance

Grayish White / Pink

Viscosity (PA*S)

A:181/B:162

Thermal Conductivity (W/M * °K)

5.1

Specific Gravity

3.3

Curing Condition

25° C x 24hrs

Hardness (Asker C)

16

Elongation (%)

30

Tensile Strength (MPA)

0.1

Dielectric Strength (KV/MM)

21

Volume Resistivity (Ohm * M)

2.3 X 10^12

Bond Line Thickness (MM)

120