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Multilayer Processing

  • Post author:Shin-Etsu MicroSi
  • Post published:April 5, 2013
  • Post category:Uncategorized

Semiconductor suppliers are constantly challenged as the semiconductor industry is one that evolves very rapidly. Throughout the years, technological advancements have led to a regular decrease in the size of…

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What is Thermal Grease?

  • Post author:Shin-Etsu MicroSi
  • Post published:April 5, 2013
  • Post category:Uncategorized

Some semiconductor manufacturing professionals may be asking the following question: what is thermal grease? Thermal grease, also called thermal grease paste, thermal grease compound and thermal conductive gel, is a…

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Copper Bumps for Flip Chip Assembly

  • Post author:Shin-Etsu MicroSi
  • Post published:April 5, 2013
  • Post category:Uncategorized

Traditional wire bonding used in the semiconductor manufacturing industry tends to have performance related issues that are tied to inductance and capacitance. Flip chip assembly, which is made using an…

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Directed Self Assembly

  • Post author:Shin-Etsu MicroSi
  • Post published:April 5, 2013
  • Post category:Uncategorized

Directed Self Assembly (DSA) is a patterning technology that could allow the semiconductor manufacturing company to create cheaper, condensed integrated circuits. In today’s industry, this is necessary because some of…

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