Skip to content
  • Applications & Solutions
      • 5g-icon5G
      • packaging-assembly-iconPackaging & Assembly
      • automotive-iconAutomotive
      • lithography-iconLithography
      • sensor-manufacturing-iconSensor Manufacturing
      • paint-coatings-iconPaint & Coatings
      • lasers-iconLasers
      • substrates-iconSubstrates
      • ceramics-iconCeramics
  • News
  • Careers
  • About Us
  • Sustainability
  • Contact Us
  • Applications & Solutions
    • 5G
    • Packaging & Assembly
    • Automotive
    • Lithography
    • Paint & Coatings
    • Lasers
    • Substrates
    • Ceramics
  • News
  • Careers
  • About Us
  • Sustainability
  • Contact
  • Applications & Solutions
    • 5G
    • Packaging & Assembly
    • Automotive
    • Lithography
    • Paint & Coatings
    • Lasers
    • Substrates
    • Ceramics
  • News
  • Careers
  • About Us
  • Sustainability
  • Contact

The Potential of the Glass Wafer Market

  • Post author:Shin-Etsu MicroSi
  • Post published:July 5, 2013
  • Post category:Uncategorized

In recent years, the semiconductor manufacturing industry has developed a considerable interest in glass and the potential benefits it could bring to operations. Glass holds valuable electrical, physical and chemical…

Continue ReadingThe Potential of the Glass Wafer Market

MEMS For Mobile Will Reach $6.8B by 2018

  • Post author:Shin-Etsu MicroSi
  • Post published:July 5, 2013
  • Post category:Uncategorized

In the past, MEMS used in mobile phones were confined to three distinct categories: inertial, filters and microphones. Today, mobile phones require a much larger range of MEMS devices. Due…

Continue ReadingMEMS For Mobile Will Reach $6.8B by 2018

Temporary Bonding Technology

  • Post author:Shin-Etsu MicroSi
  • Post published:July 5, 2013
  • Post category:Uncategorized

While thin semiconductor wafers offer many advantages, including a wide range of mechanical capabilities, greater integration of applications and larger chip storage space, semiconductor suppliers commonly run into issues due…

Continue ReadingTemporary Bonding Technology

Gold Doped Graphene

  • Post author:Shin-Etsu MicroSi
  • Post published:July 5, 2013
  • Post category:Uncategorized

UV LEDs used in the semiconductor manufacturing industry are undergoing huge changes. A short time ago, scientists used monolayer graphene for transparent conduction in nitride semiconductor manufacturing UV LEDs. Graphene…

Continue ReadingGold Doped Graphene

Contact Info

  • Address:10028 S. 51st Street, Phoenix, Arizona 85044
  • Phone:(480) 893-8898Opens in your application
  • Fax:(480) 893-8637
  • Website:microsi.com
  • About Us
    • Shin-Etsu Chemical Co. LTD
    • Other Shin-Etsu Companies
    • Research & Development
  • Sustainability
  • Legal / Regulatory
    • ISO Certified
    • General Terms and Conditions of Sale
  • Applications & Solutions
    • 5G
    • Automotive
    • Advanced Packaging Materials
    • Paint & Coatings
    • Sensor Manufacturing
    • Substrates
    • Ceramics
    • Lasers

Follow Us

  • Careers
    • Core Values
    • Equality, Diversity & Inclusion
    • Benefits
    • Opportunities
  • Document Center
    • Press Releases
    • Data Sheets
    • Blog
  • Contact
Copyright 2026, ShinEtsu Microsi

|  Privacy Policy | Terms of Use

Get In Touch with MicroSi

  • This field is for validation purposes and should be left unchanged.
×

Cart