2.5D and 3D Packaging Material Technologies
IC packaging, or integrated circuit packaging, is the final stage of semiconductor device fabrication. The block of semiconducting material is enclosed and encased in a “package” or a supporting case…
Choices for LED Encapsulants
As the LED, or light emitting diodes, lighting market continues to grow at an increasingly robust pace, the demand for LED encapsulants and underfill materials is predicted to grow accordingly.…
Using Photoresist and E Beam Resist Technology
A photoresist is a light-sensitive material used in photolithography to create a patterned coating on a surface. Some applications of photoresist are: microelectronics, patterning and etching of substrates, and fabrication…