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Performance Properties of Thermally Conductive Adhesives

  • Post author:Shin-Etsu MicroSi
  • Post published:October 5, 2014
  • Post category:Uncategorized

Thermal grease, or thermally conductive adhesive, is used in the semiconductor industry to assist a heat sink to draw heat away from semiconductor components like transistors or integrated circuits. The…

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Importance of Low Gas-Permeable Silicone

  • Post author:Shin-Etsu MicroSi
  • Post published:October 5, 2014
  • Post category:Uncategorized

There are many problems that can occur when silicone encapsulants that have a high gas permeability are used as a barrier coating for applications having to do with LEDs, especially…

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Uses of Nano-Imprint Templates

  • Post author:Shin-Etsu MicroSi
  • Post published:October 5, 2014
  • Post category:Uncategorized

Nano-imprint templates can be used in the development of many devices, such as semiconductors, storage devices, optical parts, biochips, and various MEMS devices. One benefit of using nano-imprint technologies, across…

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Functions of Die Attach

  • Post author:Shin-Etsu MicroSi
  • Post published:October 5, 2014
  • Post category:Uncategorized

The die attach process is a critical step in the manufacturing of electronic materials, and one that presents continual challenges to the industry. In the simplest of terms, die attach…

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Benefits of Contrast Enhancement

  • Post author:Shin-Etsu MicroSi
  • Post published:October 5, 2014
  • Post category:Uncategorized

Contrast enhancement material, or CEM, is a photo-bleachable material applied to the photoresist surface then removed with DI water pre-wet. There are many benefits to using contrast enhancement material.  For…

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