On a most basic level, packaging refers to the process in which the die is mounted and sealed onto the substrate. Various formations of silicone or other polymers are now…

Electronic materials rely on all components working together seamlessly. There is no room for a mistake when it comes to the manufacture of electronics, with any step along the way.Barrier…

Dry film permanent bonding is used to bond the 3D TSV, or Through-Silicon-Vias as well as two dimensional wafer bonding applications. The film comes in various thicknesses, with different applications…