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New Debonding Technology from EV Group

  • Post author:Shin-Etsu MicroSi
  • Post published:August 9, 2017
  • Post category:Uncategorized

Silicone adhesives have been utilized in the semiconductor industry for years. They resist cold and heat, are easily removable, and have dielectric properties. In recent years, new solutions have been sought…

Continue ReadingNew Debonding Technology from EV Group

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