Wafer-level Packaging Devices to Outperform Flip Chip Tech Shipments
The flip chip (FC) packaging sector is projected to reach a little over US$ 31 billion by 2022, but demand for wafer level packaging (WLP) is soaring even higher. WLP…
The flip chip (FC) packaging sector is projected to reach a little over US$ 31 billion by 2022, but demand for wafer level packaging (WLP) is soaring even higher. WLP…