Skip to content
  • Applications & Solutions
      • 5g-icon5G
      • packaging-assembly-iconPackaging & Assembly
      • automotive-iconAutomotive
      • lithography-iconLithography
      • sensor-manufacturing-iconSensor Manufacturing
      • paint-coatings-iconPaint & Coatings
      • lasers-iconLasers
      • substrates-iconSubstrates
      • ceramics-iconCeramics
  • News
  • Careers
  • About Us
  • Sustainability
  • Contact Us
  • Applications & Solutions
    • 5G
    • Packaging & Assembly
    • Automotive
    • Lithography
    • Paint & Coatings
    • Lasers
    • Substrates
    • Ceramics
  • News
  • Careers
  • About Us
  • Sustainability
  • Contact
  • Applications & Solutions
    • 5G
    • Packaging & Assembly
    • Automotive
    • Lithography
    • Paint & Coatings
    • Lasers
    • Substrates
    • Ceramics
  • News
  • Careers
  • About Us
  • Sustainability
  • Contact

Confronting Safety Issues in IoT Design

  • Post author:Shin-Etsu MicroSi
  • Post published:October 18, 2017
  • Post category:Uncategorized

Safety issues in IoT design have come to the forefront of public discussion. Self-driving cars in particular raise safety concerns, which demand robust solutions. The Internet of Things (IoT) is…

Continue ReadingConfronting Safety Issues in IoT Design

Reducing Waste in Chip Manufacturing

  • Post author:Shin-Etsu MicroSi
  • Post published:October 11, 2017
  • Post category:Uncategorized

The semiconductor industry’s waste affects the earth as much as it does manufacturers’ bank accounts. Chip manufacturing results in emissions of ammonia, highly reactive hydrogen peroxide, and corrosive acids, among…

Continue ReadingReducing Waste in Chip Manufacturing
Read more about the article What is advanced packaging?

What is advanced packaging?

  • Post author:Shin-Etsu MicroSi
  • Post published:October 4, 2017
  • Post category:Uncategorized

Advanced packaging developed as a means of improving device performance while shrinking packages at the same time. Improvements continue along this track. To understand where we are today, let's go…

Continue ReadingWhat is advanced packaging?

Japan’s Semiconductor Industry Leads in Robotics

  • Post author:Shin-Etsu MicroSi
  • Post published:September 28, 2017
  • Post category:Uncategorized

Japan is still holding onto its decades-long grip on the electronics industry amidst South Korea and Taiwan’s rivalry. Its five tech titans manufacture 80% of all component-mounting robots. A diminutive…

Continue ReadingJapan’s Semiconductor Industry Leads in Robotics

Silicon Photonics Challenges

  • Post author:Shin-Etsu MicroSi
  • Post published:September 19, 2017
  • Post category:Uncategorized

Silicon integrated circuitry can transfer information over tremendous distances at the cost of an ever more economical manufacturing process. Silicon photonics will revolutionize computing, sensing, and data centers—worthy goals in…

Continue ReadingSilicon Photonics Challenges

Growth in North American Semiconductor Equipment Manufacturing

  • Post author:Shin-Etsu MicroSi
  • Post published:September 11, 2017
  • Post category:Uncategorized

The global semiconductor industry’s fab equipment spending is soaring to meet manufacturing demand. Intel is parting with its cash in buckets, followed by second and third place spenders, Samsung and…

Continue ReadingGrowth in North American Semiconductor Equipment Manufacturing

Silicon Wafer Market M&As

  • Post author:Shin-Etsu MicroSi
  • Post published:September 4, 2017
  • Post category:Uncategorized

Mergers and acquisitions have sent the silicon wafer market scurrying all over the map this year. Taiwan’s snapping up brands in the USA, South Korea is feasting on its own…

Continue ReadingSilicon Wafer Market M&As

Latest Innovations in Chip Manufacturing

  • Post author:Shin-Etsu MicroSi
  • Post published:August 23, 2017
  • Post category:Uncategorized

Moore’s Law stated that the number of transistors on a single chip would double every two years for at least a decade, but this level of acceleration has plateaued. Today,…

Continue ReadingLatest Innovations in Chip Manufacturing

IoT Chip Design: Not One Size Fits All

  • Post author:Shin-Etsu MicroSi
  • Post published:August 16, 2017
  • Post category:Uncategorized

The internet of things (IoT) isn’t as preternatural a creature as you might think, but that doesn’t mean its definition is cut out of bricks and mortar. Broadly, it can…

Continue ReadingIoT Chip Design: Not One Size Fits All

New Debonding Technology from EV Group

  • Post author:Shin-Etsu MicroSi
  • Post published:August 9, 2017
  • Post category:Uncategorized

Silicone adhesives have been utilized in the semiconductor industry for years. They resist cold and heat, are easily removable, and have dielectric properties. In recent years, new solutions have been sought…

Continue ReadingNew Debonding Technology from EV Group
  • Go to the previous page
  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • …
  • 22
  • Go to the next page

Contact Info

  • Address:10028 S. 51st Street, Phoenix, Arizona 85044
  • Phone:(480) 893-8898Opens in your application
  • Fax:(480) 893-8637
  • Website:microsi.com
  • About Us
    • Shin-Etsu Chemical Co. LTD
    • Other Shin-Etsu Companies
    • Research & Development
  • Sustainability
  • Legal / Regulatory
    • ISO Certified
    • General Terms and Conditions of Sale
  • Applications & Solutions
    • 5G
    • Automotive
    • Advanced Packaging Materials
    • Paint & Coatings
    • Sensor Manufacturing
    • Substrates
    • Ceramics
    • Lasers

Follow Us

  • Careers
    • Core Values
    • Equality, Diversity & Inclusion
    • Benefits
    • Opportunities
  • Document Center
    • Press Releases
    • Data Sheets
    • Blog
  • Contact
Copyright 2026, ShinEtsu Microsi

|  Privacy Policy | Terms of Use

Get In Touch with MicroSi

  • This field is for validation purposes and should be left unchanged.
×

Cart