Blog - Page 18 of 24 - Shin-Etsu MicroSi

Electronic materials rely on all components working together seamlessly. There is no room for a mistake when it comes to the manufacture of electronics, with

Dry film permanent bonding is used to bond the 3D TSV, or Through-Silicon-Vias as well as two dimensional wafer bonding applications. The film comes in

Thermal grease, or thermally conductive adhesive, is used in the semiconductor industry to assist a heat sink to draw heat away from semiconductor components like

There are many problems that can occur when silicone encapsulants that have a high gas permeability are used as a barrier coating for applications having

Nano-imprint templates can be used in the development of many devices, such as semiconductors, storage devices, optical parts, biochips, and various MEMS devices. One benefit

The die attach process is a critical step in the manufacturing of electronic materials, and one that presents continual challenges to the industry. In the

Contrast enhancement material, or CEM, is a photo-bleachable material applied to the photoresist surface then removed with DI water pre-wet. There are many benefits to

IC packaging, or integrated circuit packaging, is the final stage of semiconductor device fabrication. The block of semiconducting material is enclosed and encased in a

A photoresist is a light-sensitive material used in photolithography to create a patterned coating on a surface. Some applications of photoresist are: microelectronics, patterning and