Product Line
CEM
CHALINE®
Exterior
Glass
Interior
MicroPrime
SAIL
Scutum® Photocatalyst
SINR
SIPR
SOLBIN®
TC Pad Series
Tersus® Photocatalyst
TIM 1 - Thermal Gel
TIM 1.5 - Two-Part Curable Gap Fillers
TIM 2 - Thermal Grease
Undercoating
VINYBLAN®
VIOSIL-SG1B
VIOSIL-SG1C
VIOSIL-SG2A
VIOSIL-SG2B
VIOSIL-SG2C
VIOSIL-SQ
VIOSIL-SX
-
KMC-165
- Lead Frame | Molding Compounds | Packaging & Assembly
- Shin-Etsu is a world leader in silicone molding compound and epoxy molding compound technology for use in semiconductor packaging. We have nearly fifty years of…
- Read more
-
KMC-180
- Lead Frame | Molding Compounds | Packaging & Assembly
- Shin-Etsu is a world leader in silicone molding compound and epoxy molding compound technology for use in semiconductor packaging. We have nearly fifty years of…
- Read more