Encapsulants & Underfills

The KJR Series offers very low Ionic impurities. These products are extremely pure, providing superior stability to all types of semiconductor devices. The most critical impurity, chloride ion, is kept to an absolute minimum, greatly reducing the risk of electrode corrosion.

Shin-Etsu KJR silicone encapsulant series can be classified into three categories according to the chemical curing mechanism used. The manufacturing process and or the specific characteristics of the device may dictate which product group will best fit your requirement.

• Rigid: After curing, the coating of the encapsulant material hardens to a highly rigid polyimide. It has excellent adhesive properties and is an ideal coating for particularly high voltage resistant devices.
• Flexible: After curing, this coating material has outstanding rubber elastic properties. By absorbing stress due to external forces, it can prevent fracturing of the devices.
• Gel: After curing, this coating material is a soft gel type material. It has extremely low stress and provides the maximum buffer effect available. Its superb adhesion strength and lead sealing, it provides the best humidity protection.

The curing conditions for some of the KJR products are listed below: