Description
Shin-Etsu MicroSi’s SIPR 9361 I-line/G-line photoresist has a printing capability of less than 1 um isolated line and high profile images in 6 um thick film photoresist and designed as a permanent insulation layer. This DNQ photoresist is widely used in semiconductor, MEMS and thin film head for passivation, stress buffer layer and permanent insulation layer that require high cross linking and low thermal expansion properties. Though TMAH developer is preferred, KOH is also acceptable.