Product Line
CEM
CHALINE®
Exterior
Glass
Interior
MicroPrime
SAIL
Scutum® Photocatalyst
SEPR
SINR
SIPR
SOLBIN®
TC Pad Series
Tersus® Photocatalyst
TIM 1 - Thermal Gel
TIM 1.5 - Two-Part Curable Gap Fillers
TIM 2 - Thermal Grease
Undercoating
VINYBLAN®
VIOSIL-SG1B
VIOSIL-SG1C
VIOSIL-SG2A
VIOSIL-SG2B
VIOSIL-SG2C
VIOSIL-SQ
VIOSIL-SX
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SIPR 3251 10-20µm
- Bump Photoresists | I-Line / G-Line / Broadband Resists | Lithography | Packaging & Assembly
- Shin-Etsu MicroSi’s SIPR 3251 I-line/G-line photoresist has a printing capability of less than 250 nm isolated line and semi-dense lines in 1-6 um thick films.…
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SIPR 3251 2µm
- Bump Photoresists | Packaging & Assembly
- Shin-Etsu MicroSi’s SIPR 3251 I-line/G-line photoresist has a printing capability of less than 250 nm isolated line and semi-dense lines in 1-6 um thick films.…
- Read more
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SIPR 3251 4µm
- Bump Photoresists | I-Line / G-Line / Broadband Resists | Lithography | Packaging & Assembly
- Shin-Etsu MicroSi’s SIPR 3251 I-line/G-line photoresist has a printing capability of less than 250 nm isolated line and semi-dense lines in 1-6 um thick films.…
- Read more
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SIPR 3251 6µm
- Bump Photoresists | I-Line / G-Line / Broadband Resists | Lithography | Packaging & Assembly
- Shin-Etsu MicroSi’s SIPR 3251 I-line/G-line photoresist has a printing capability of less than 250 nm isolated line and semi-dense lines in 1-6 um thick films.…
- Read more
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SIPR 9332BE10
- Bump Photoresists | I-Line / G-Line / Broadband Resists | Lithography | Packaging & Assembly
- Shin-Etsu MicroSi’s SIPR 9332 I-line/G-line photoresist is designed for applications that require high thermal stability for ion implantation and dry etching environment. Though TMAH developer…
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SIPR 9361
- Bump Photoresists | I-Line / G-Line / Broadband Resists | Lithography | Packaging & Assembly
- Shin-Etsu MicroSi’s SIPR 9361 I-line/G-line photoresist has a printing capability of less than 1 um isolated line and high profile images in 6 um thick…
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