Description
Polyimide Silicone Chip Coating Materials
- High adhesive stability
- High electrical insulative properties
KJR-657E
Shin-Etsu is a leader in developing advanced, semiconductor packaging materials for encapsulating all types of semiconductor devices. This broad line of products is made of silicone molding compounds and epoxy molding compounds that offer low stress, very low warpage, and high thermal conductivity.
Additional information
| Features | Thick Film |
|---|---|
| Solvent | NM2P/MeOH |
| Storage Temp. (°C) | 5 |
| Dielectric Breakdown V/0.1mm | 12 |
| Young’s Modulus GPa | 2.3 |
| Tg (°C) | 230 |