Product Line
CEM
CHALINE®
Exterior
Glass
Interior
MicroPrime
SAIL
Scutum® Photocatalyst
SEPR
SINR
SIPR
SOLBIN®
TC Pad Series
Tersus® Photocatalyst
TIM 1 - Thermal Gel
TIM 1.5 - Two-Part Curable Gap Fillers
TIM 2 - Thermal Grease
Undercoating
VINYBLAN®
VIOSIL-SG1B
VIOSIL-SG1C
VIOSIL-SG2A
VIOSIL-SG2B
VIOSIL-SG2C
VIOSIL-SQ
VIOSIL-SX
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KJR-651E
- 5G | Automotive | Encapsulants & Underfills | LCD Electride Protection Coating | Packaging & Assembly | Polyimide Silicone Chip Coating Materials [Adhesion & Insulation Improvement] | Polyimide Silicone Materials [Adhesion & Insulation Improvement] | Rigid
- Shin-Etsu is a leader in developing advanced, semiconductor packaging materials for encapsulating all types of semiconductor devices. This broad line of products is made of…
- Read more
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KJR-655E
- 5G | Automotive | Polyimide Silicone Chip Coating Materials [Adhesion & Insulation Improvement] | Polyimide Silicone Materials [Adhesion & Insulation Improvement]
- Shin-Etsu is a leader in developing advanced, semiconductor packaging materials for encapsulating all types of semiconductor devices. This broad line of products is made of…
- Read more
-
KJR-657E
- 5G | Automotive | Polyimide Silicone Chip Coating Materials [Adhesion & Insulation Improvement] | Polyimide Silicone Materials [Adhesion & Insulation Improvement]
- Shin-Etsu is a leader in developing advanced, semiconductor packaging materials for encapsulating all types of semiconductor devices. This broad line of products is made of…
- Read more