Dry film permanent bonding is used to bond the 3D TSV, or Through-Silicon-Vias as well as two dimensional wafer bonding applications. The film comes in various thicknesses, with different applications…

Thermal grease, or thermally conductive adhesive, is used in the semiconductor industry to assist a heat sink to draw heat away from semiconductor components like transistors or integrated circuits. The…

There are many problems that can occur when silicone encapsulants that have a high gas permeability are used as a barrier coating for applications having to do with LEDs, especially…

Nano-imprint templates can be used in the development of many devices, such as semiconductors, storage devices, optical parts, biochips, and various MEMS devices. One benefit of using nano-imprint technologies, across…

The die attach process is a critical step in the manufacturing of electronic materials, and one that presents continual challenges to the industry. In the simplest of terms, die attach…

Contrast enhancement material, or CEM, is a photo-bleachable material applied to the photoresist surface then removed with DI water pre-wet. There are many benefits to using contrast enhancement material.  For…

IC packaging, or integrated circuit packaging, is the final stage of semiconductor device fabrication. The block of semiconducting material is enclosed and encased in a “package” or a supporting case…

A photoresist is a light-sensitive material used in photolithography to create a patterned coating on a surface. Some applications of photoresist are: microelectronics, patterning and etching of substrates, and fabrication…

There are so many varieties of adhesives out there on the market, made initially to serve the semiconductor industry, each with distinct properties and applications. Are you looking for a…