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Industry Sustainability Efforts Grow

  • Post author:Shin-Etsu MicroSi
  • Post published:August 5, 2014
  • Post category:Uncategorized

Many semiconductor experts and businesses look forward to the day when 7nm and 5nm technologies are released for use in the semiconductor industry. To accompany these new technologies, new materials,…

Continue ReadingIndustry Sustainability Efforts Grow

Transition 450mm Toward Sustainability

  • Post author:Shin-Etsu MicroSi
  • Post published:August 5, 2014
  • Post category:Uncategorized

With the development of the 450mm silicon semiconductor fab, the industry is focusing on creating a design with more advanced integrated circuits that is also environmentally friendly and cost effective.…

Continue ReadingTransition 450mm Toward Sustainability

Striving to Reach 7nm and 5nm Chips

  • Post author:Shin-Etsu MicroSi
  • Post published:July 5, 2014
  • Post category:Uncategorized

While semiconductor industry producers are fairly confident that they can scale chips to 10nm, they are less so when it comes to 7nm and 5nm chips. With 10nm, the scaling…

Continue ReadingStriving to Reach 7nm and 5nm Chips

Growth in the Mobile Packaging Market

  • Post author:Shin-Etsu MicroSi
  • Post published:July 5, 2014
  • Post category:Uncategorized

Mobile products have long been packaged used Package-on-Package (PoP) technology, which consists of flip-chip interconnects with ball grid array balls located near the bottom. This technology is similar to other…

Continue ReadingGrowth in the Mobile Packaging Market

Strong Analog Chip Demand Boosts Texas Instruments Forecast

  • Post author:Shin-Etsu MicroSi
  • Post published:June 5, 2014
  • Post category:Uncategorized

Texas Instruments Inc. reported a three percent rise in first-quarter revenue due to strong growth in its analog chip business and improved demand for its chips used in cars, appliances,…

Continue ReadingStrong Analog Chip Demand Boosts Texas Instruments Forecast

IBM’s 3D Printer to Revolutionize Chip Prototyping

  • Post author:Shin-Etsu MicroSi
  • Post published:June 5, 2014
  • Post category:Uncategorized

IBM Research has developed a small 3D printer, called the NanoFrazor, which can produce nanometer-level patterns on a soft polymer that can then be transported to silicon, gallium arsenide or…

Continue ReadingIBM’s 3D Printer to Revolutionize Chip Prototyping

Resins Market Update

  • Post author:Shin-Etsu MicroSi
  • Post published:May 5, 2014
  • Post category:Uncategorized

The resins market held its own over the last year while showing signs of recovery from the economic slump. According to the American Chemistry Council (ACC), U.S. resin production increased…

Continue ReadingResins Market Update

Low- and Zero-VOC Paint Technology

  • Post author:Shin-Etsu MicroSi
  • Post published:May 5, 2014
  • Post category:Uncategorized

Typical household paint contains up to 10,000 chemicals, of which 300 are known toxins and 150 have been linked to cancer. Some of the most harmful chemicals found in paint are volatile…

Continue ReadingLow- and Zero-VOC Paint Technology

Global Tablet Shipments Drop 30% Sequentially in 1Q14

  • Post author:Shin-Etsu MicroSi
  • Post published:April 5, 2014
  • Post category:Uncategorized

Global tablet shipments reached only 58.56 million units in the first quarter of 2014, this is about 30% less compared to the last quarter of 2013. Seasonality, Apple seeing weaker…

Continue ReadingGlobal Tablet Shipments Drop 30% Sequentially in 1Q14

How to Select Thermal Interface Materials

  • Post author:Shin-Etsu MicroSi
  • Post published:April 5, 2014
  • Post category:Uncategorized

Thermal interface materials, such as thermal silicone and thermal grease, are used to improve thermal conduction between two parts, especially in electronics where temperatures often become elevated. These materials work…

Continue ReadingHow to Select Thermal Interface Materials
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