Product Line
CEM
CHALINE®
Exterior
Glass
Interior
MicroPrime
SAIL
Scutum® Photocatalyst
SEPR
SINR
SIPR
SOLBIN®
TC Pad Series
Tersus® Photocatalyst
TIM 1 - Thermal Gel
TIM 1.5 - Two-Part Curable Gap Fillers
TIM 2 - Thermal Grease
Undercoating
VINYBLAN®
VIOSIL-SG1B
VIOSIL-SG1C
VIOSIL-SG2A
VIOSIL-SG2B
VIOSIL-SG2C
VIOSIL-SQ
VIOSIL-SX
-
SINR 3570M
- 5G | Photoimageable Dielectrics | Sensor Manufacturing | TSV Filling
- Based on SINR-3170 chemistry Modified for bonding at room temperature Good adhesion for bonding: Chip-to-wafer Wafer-to-wafer Wafer-to-glass 70%-siloxane content for minimal wafer bowing Same 180°C/1…
- Read more