Product Line
CEM
CHALINE®
Exterior
Glass
Interior
MicroPrime
SAIL
Scutum® Photocatalyst
SEPR
SINR
SIPR
SOLBIN®
TC Pad Series
Tersus® Photocatalyst
TIM 1 - Thermal Gel
TIM 1.5 - Two-Part Curable Gap Fillers
TIM 2 - Thermal Grease
Undercoating
VINYBLAN®
VIOSIL-SG1B
VIOSIL-SG1C
VIOSIL-SG2A
VIOSIL-SG2B
VIOSIL-SG2C
VIOSIL-SQ
VIOSIL-SX
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G769EL
- Packaging & Assembly | Thermal Interface Materials [TIM]
- Thermal grease, G765, is a Non-Solvent thermal interface material developed and manufactured by Shin-Etsu Chemical Co., Ltd. Shin-Etsu MicroSi’s G765 exceeds thermal management requirements of…
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PCS Series
- Packaging & Assembly | Phase Change Material [PCM] | Thermal Interface Materials [TIM]
- Shin-Etsu Chemical’s thermally conductive phase change thermal pad utilizes phase change material that offers superior cooling solutions for increased thermal management. The PCS series phase…
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TC-CG 20CG
- High Hardness Thermal Interface Silicone Rubber Pad Materials | Packaging & Assembly | Thermal Interface Materials [TIM]
- Shin-Etsu Chemical’s High Hardness TC pad series offers a high thermal conductivity and a low thermal resistance solution that outperforms common organic rubbers and plastics.
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TC-CG 30CG
- High Hardness Thermal Interface Silicone Rubber Pad Materials | Packaging & Assembly | Thermal Interface Materials [TIM]
- Shin-Etsu Chemical’s High Hardness TC pad series offers a high thermal conductivity and a low thermal resistance solution that outperforms common organic rubbers and plastics.
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TC-CG 45CG
- High Hardness Thermal Interface Silicone Rubber Pad Materials | Packaging & Assembly | Thermal Interface Materials [TIM]
- Shin-Etsu Chemical’s High Hardness TC pad series offers a high thermal conductivity and a low thermal resistance solution that outperforms common organic rubbers and plastics.
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TC-CG 80CG
- High Hardness Thermal Interface Silicone Rubber Pad Materials | Packaging & Assembly | Thermal Interface Materials [TIM]
- Shin-Etsu Chemical’s High Hardness TC pad series offers a high thermal conductivity and a low thermal resistance solution that outperforms common organic rubbers and plastics.
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TC-SAS-10SAS
- Double-Sided Tape | Packaging & Assembly | Thermal Interface Materials [TIM]
- Shin-Etsu Chemical’s TC-SAS thermal conductive tape is a non-acryl based, adhesive, double sided thermal tape that offers superior thermal conductivity, peeling and high adhesion strength…
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TC-SAS-20SAS
- Double-Sided Tape | Packaging & Assembly | Thermal Interface Materials [TIM]
- Shin-Etsu Chemical’s TC-SAS thermal conductive tape is a non-acryl based, adhesive, double sided thermal tape that offers superior thermal conductivity, peeling and high adhesion strength…
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Thermal Grease G751
- LED Encapsulant Materials | Packaging & Assembly | Thermal Interface Materials [TIM] | TIM
- Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s G-751 thermal interface material…
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Thermal Grease X-23-7762
- Packaging & Assembly | Thermal Interface Materials [TIM]
- Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s X23- 7762 thermal interface…
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Thermal Grease X-23-7783D
- Packaging & Assembly | Thermal Interface Materials [TIM]
- Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s X23- 7783D thermal interface…
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Thermal Grease X-23-7868-2D
- Packaging & Assembly | Thermal Interface Materials [TIM]
- Package temperature constraints can severely limit a power device’s performance. Both the performance reliability and life expectancy are inversely related to the device temperature. Shin-Etsu…
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Thermal Grease X-23-7869-2D
- Packaging & Assembly | Thermal Interface Materials [TIM]
- X23-7869-2D, is a thermal interface material developed and manufactured by Shin-Etsu Chemical with ease of application in mind. Specifically formulated to include an application chemical…
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Thermal Grease X-23-7911
- Packaging & Assembly | Thermal Interface Materials [TIM]
- Thermal grease, X23-7911, is a Non-Solvent thermal interface material developed and manufactured by Shin-Etsu Chemical Co., Ltd. Shin-Etsu MicroSi’s X23-7911 exceeds thermal management requirements of high-performance semiconductor…
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Thermal Grease X-23-7921-5
- Packaging & Assembly | Thermal Interface Materials [TIM]
- Thermal grease, X-23-7921-5, is a Non-Solvent type of thermal interface material developed by Shin-Etsu Chemical Co., Ltd. (hereinafter SEC) to meet the current and future…
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Thermal Grease X-23-7943
- Packaging & Assembly | Thermal Interface Materials [TIM]
- Thermal grease, X23-7943, is a Non-Solvent thermal interface material developed and manufactured by Shin-Etsu Chemical Co., Ltd. Shin-Etsu MicroSi’s X23-7943 exceeds thermal management requirements of high-performance semiconductor…
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Thermal Grease X-23-8117
- Packaging & Assembly | Thermal Interface Materials [TIM]
- Shin-Etsu’s X-23-8117 product offering is a thermal interface material developed and manufactured with ease of application in mind. Specifically formulated to include an application chemical…
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X-23-7772-4
- Packaging & Assembly | Thermal Interface Materials [TIM]
- Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s X-23- 7772-4 thermal interface…
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X-23-8039-A/B
- Packaging & Assembly | Thermal Interface Materials [TIM]
- X23-8039 A/B is a two part gap filler. It can be cured with either heat or at room temperature. X23-8039 A/B is a thermal interface…
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X-23-8043-A/B
- Packaging & Assembly | Thermal Interface Materials [TIM]
- X23-80343 A/B is a two part gap filler. It can be cured with either heat or at room temperature. X23-8043A/B is a thermal interface gap…
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X-23-8051-A/B
- Packaging & Assembly | Thermal Interface Materials [TIM]
- X23-80351A/B is a two part gap filler. It can be cured with either heat or at room temperature. X23-8051 A/B is a thermal interface gap…
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X-23-8068-A/B
- Packaging & Assembly | Thermal Interface Materials [TIM]
- X23-8068 A/B is a two part gap filler. It can be cured with either heat or at room temperature. X23-8068 A/B is a thermal interface…
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X-23-8098-A/B
- Packaging & Assembly | Thermal Interface Materials [TIM]
- X23-8098-A/B is a two part gap filler. It can be cured with either heat or at room temperature. X23-8098-A/B is a thermal interface gap filler…
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